...surviving 500 G impacts. NOT socketed! All SMT and firmly soldered in place.
Trick is to dip first into GE-RTV silicone rubber (real watery, clear, self releasing two part stuff) to provide an easily removable conformal coating. Let it cure, then pot with a urethane or epoxy filled with micro-balloons (syntactic foam filler) for strength and light weight.
Whole package is pretty much indestructible--and can still be taken apart for repair or failure analysis.
We soldered the eproms into turned pin DIL headers (the type with the solder buckets) and these were plugged into turned pin DIL sockets (all gold plated type). There was enough room under the socket to fit a small nylon tie wrap which held the whole assembley pretty secure. We had no problems, but the resulting arrangement could hardly be called "low profile"
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