Post by thread:PIC packages ...

What do the codes for the packaging of PIC microcontrollers stand for - specifically: 68PLCC, 64-DIP, 18-DIP, SO-18, 44PLCC, 40-DIP, 40-CDIP, 28-SDIP, 28-SOIC? I've been out of electronic design for many years - I assume that 18-DIP is simply 18 pin DIP packaging with pin spacing like the old 7400 TTL logic chips, .1" spacing. But what about the others?

In a message dated 1/30/00 5:57:46 PM Pacific Standard Time, spam_OUTcwmoserTakeThisOuTMINDSPRING.COM writes: > What do the codes for the packaging of PIC microcontrollers stand for - > specifically: > 68PLCC, 64-DIP, 18-DIP, SO-18, 44PLCC, 40-DIP, 40-CDIP, 28-SDIP, > 28-SOIC? 68PLCC is 68-pin Plastic Leaded Chip Carrier (PLCC). 64-DIP is I imagine..a 64 pin DIP package. SO-18 is a Small Outline 18-pin package. 44PLCC again is 44-pin PLCC 40-CDIP is 40-pin Ceramic DIP 28-SDIP is 28-pin Skinny DIP (300 mil body) and finally... 28-SOIC is Small Outline IC (Gull Wing (whatever that means) 300 mil body) Hope this helps, Tim Hamel > > I've been out of electronic design for many years - I assume that 18-DIP is > simply 18 pin DIP packaging with pin spacing like the old 7400 TTL logic > chips, .1" spacing. But what about the others? >

At 09:12 PM 01/30/2000 -0500, Tim Hamel wrote: >28-SOIC is Small Outline IC (Gull Wing (whatever that means) 300 mil body) Gull-wing packages are simply the type of surface-mount packages you normally see, where the leads extend from the package and curve down before bending out again. Hence the "gull-wing" name. The other type is "J-lead" where the pins bend back under the package - these you often see on commercially-made memory modules, where pad space is at a premium. mcb ------------------------------------------------------------------- Matt Burch | Pinnacle Technology | tel: (785) 832-8866 Project Engineer | 619 E. 8th St. Suite D | fax: (785) 749-9214 .....mburchKILLspam@spam@pinnaclet.com | Lawrence, KS 66044 | http://www.pinnaclet.com -------------------------------------------------------------------

> What do the codes for the packaging of PIC microcontrollers stand for - > specifically: > 68PLCC, 64-DIP, 18-DIP, SO-18, 44PLCC, 40-DIP, 40-CDIP, 28-SDIP, > 28-SOIC? > > I've been out of electronic design for many years - I assume that 18-DIP is > simply 18 pin DIP packaging with pin spacing like the old 7400 TTL logic > chips, .1" spacing. But what about the others? Consulting a manufacturers data book will show all but briefly... the number stands for the number of leads on the device and the letters are abbreviations of the package name. PLCC stands for Plastic Leaded Chip Carrier SO=small outline SOIC=small outline integrated circuit PDIP=plastic dual inline package CDIP=ceramic dual inline package etc I think that TBSTSOS would be appropriate for some of the new variety...... Too Bloody Small To See Or Solder _____________________________ Lance Allen Technical Officer Uni of Auckland Psych Dept New Zealand http://www.psych.auckland.ac.nz _____________________________

68PLCC is 68-pin Plastic Leaded Chip Carrier (PLCC). That means a plastic package with .05 inch spaced leads on all four sides. 64-DIP is I imagine..a 64 pin DIP package. Usually wider than the normal .6 inches, as well. The original 68000 processor came in a 64pin DIP with .9 inch lead row spacing. SO-18 is a Small Outline 18-pin package. Pins on two sides at 0.05 inch spacing. Width can vary quite a bit. 44PLCC again is 44-pin PLCC Like 68PLCC, only smaller. 28-SOIC is Small Outline IC (Gull Wing (whatever that means) 300 mil body) (width can also vary.) TSSOP - Thin small outline package. VSOP - Very small outline packege. BGA - Ball grid array. PGA - Pin grid array. BillW