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'[SOT] which is easier to prototype'
1999\05\21@234510 by Donald L Burdette

picon face
>I plan on prototyping with some Atmel DataFlash parts this summer. They
>only come in SOIC and TSOP packages. Which is easier to socket for
>prototyping?

SOIC pins are on 0.050" spacing.  TSOP are on 0.020" spacing.  Which do
you think is easier?

In case even that's not obvious, I can say that I cut my teeth for quite
a while on SOIC before I would even have thought of trying to solder a
TSOP package.  Even now, several years later, I avoid TSOP packages if at
all possible.

Soldering TSOP's is not too horrendous the first time - you just need
lots of flux.  I literally bathe the pins in liquid flux, then rake the
iron across the pins.  Solder wick can be used to clean the occasional
bridge.  Reworking is another story.  You need the proper tools, steady
hands, patience, and some chips and boards you can afford to destroy.
And if you're thinking of using sockets, keep in mind they are MUCH
harder to solder to a board than are the chips.

For prototyping, I'd go with PLCC.  The sockets are cheap, while SOIC and
TSOP sockets are mucho denero.  PLCC sockets are available in
through-hole configurations, making soldering a trivial task.  The
packages are larger, but the strain on your sanity will be much smaller.

Hope this helps.


Don
spam_OUTdlburdetteTakeThisOuTspamjuno.com

1999\05\22@211210 by Byron A Jeff

face picon face
>
> >I plan on prototyping with some Atmel DataFlash parts this summer. They
> >only come in SOIC and TSOP packages. Which is easier to socket for
> >prototyping?
>
> SOIC pins are on 0.050" spacing.  TSOP are on 0.020" spacing.  Which do
> you think is easier?

So SOIC it is. Another question: What's the difference between SOIC and SOJ?
I've taken a look at the digikey adapters and the 32 pin adapter is SOJ.
Would I be able to solder an SOIC in its place?

> For prototyping, I'd go with PLCC.  The sockets are cheap, while SOIC and
> TSOP sockets are mucho denero.  PLCC sockets are available in
> through-hole configurations, making soldering a trivial task.  The
> packages are larger, but the strain on your sanity will be much smaller.

As much as I'd love to use PLCC, the DataFlash parts don't have a PLCC
package for that size. The 16 Mbit parts do have PLCC packaging, but none
of the distributors seem to have any in stock.

I'll plan to adapt SOIC for my work.

>
> Hope this helps.

Greatly. Much Appriciated.

BAJ

1999\05\22@221758 by Jim Paul

picon face
Byron,

I just got 2 samples each of the 2 megabit and the 4 megabit both in 32 pin
PLCC packages.
I asked my local distributor for samples.  It took about a week to get them
though.   But, I have
the PLCC for prototyping.  Will move to SOIC at production.


Regards,


Jim

{Original Message removed}

1999\05\22@225015 by Bob Drzyzgula

flavicon
face
On Sat, May 22, 1999 at 02:27:24PM -0400, Byron A Jeff wrote:
> >
>
> So SOIC it is. Another question: What's the difference between SOIC and SOJ?
> I've taken a look at the digikey adapters and the 32 pin adapter is SOJ.
> Would I be able to solder an SOIC in its place?

SOIC has "gull-wing" leads, which bend down from mid-way up
the side of the package and then extend out away from the
package body, like

----\
   |
   |\
   | \
----/  \_______

SOJ parts have "J" leads, which, like the name suggests,
have J-shaped leads, with the ends curled around and back
up toward the package.

----\
   |__
   |  |
   |  |
----/  |
      |
   \__/

SOJ sockets are fairly cheap; DRAM often comes in SOJ,
and you may have seen SOJ sockets on PC video cards for
holding expansion memory.

--Bob

--
============================================================
Bob Drzyzgula                             It's not a problem
.....bobKILLspamspam@spam@drzyzgula.org                until something bad happens
============================================================

1999\05\23@072341 by paulb

flavicon
face
Bob Drzyzgula wrote:

> SOJ parts have "J" leads, which, like the name suggests,
> have J-shaped leads, with the ends curled around and back
> up toward the package.

> ----\
>     |__
>     |  |
>     |  |
> ----/  |
>        |
>     \__/

 Am I correct in presuming that the leads on the SOJ package not only
curl up *towards* the package, but are in fact bolstered against the
encapsulation to prevent bending out of shape during handling and in
particular, socket insertion?
--
 Cheers,
       Paul B.

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