We do a lot of potting on surface mount circuits and perhaps these
recommendations may be helpful:
i) If you are working with surface mount, it a good idea to apply a few
coats of silicon conformal coating to your circuit before potting. This
prevents the potting from flowing underneath chips. Some potting materials
expand on drying, causing enough pressure to literally 'pop' off the chip.
ii) Appication of heat speeds drying but can be very counterproductive.
Excessive heat may damage components or make the potting so viscous that it
simply flows off the board. A 100 watt light bulb is often enough to speed
the process considerably. When in a rush, we cure pottiing in a 80C oven,
but I like to plan ahead and allow the potting to set overnight at room
temperature.
iii) If you are using an encapsulating material that is not specifically
designed for electronic components be certain you understand its electrical
properties. The encapsulating material may affect circuit performance. Also,
you may find that your circuit doesn't work properly until the potting has
fully set, and this may take days. Myke Predko mentions such a problem in
his PIC book.
The following link is for a potting system from M.G. Chemicals. If I
remember correctly, this product sells for under $15. It is designed
specifically for electronic circuits.
http://www.mgchemicals.com/products/832.html
Shawn
----- Original Message -----
From: "Ashley Roll" <KILLspamashKILLspam
DIGITALNEMESIS.COM>
To: <RemoveMEPICLISTTakeThisOuT
MITVMA.MIT.EDU>
Sent: Wednesday, March 27, 2002 5:22 PM
Subject: Re: [OT]:Casting plastics?
> Hi Everyone,
>
> Another trick is that with the "casting" resins, you can do it in layers
and
> as long as you're in a clean environment to stop dust settling on the
> layers, you won't see the line between the layers as it will bond
together.
>
> Doing it in layers means that there is less resin to cure at a time and
the
{Quote hidden}> heat generated is much more easily decapitated so you can use a faster
> curing rate by using more catalyst.
>
> This is how most of the embedded objects are done IIRC, the first layer
> provides the base, then the object is placed in it and the mould filled.
>
> Cheers,
> Ash.
>
> ---
> Ashley Roll
> Digital Nemesis Pty Ltd
>
http://www.digitalnemesis.com
> Mobile: +61 (0)417 705 718
>
>
>
>
> > {Original Message removed}