>I can see that. The components wouldn't generate much heat (if designed
>carefully they would emit very little heat).
>
>Put them inside an insulated container with a stack of peltiers...
>
>Then you'd only have to find out the differential each peltier could
>handle, it's current consumption at that differential, and the total
>difference between the two temperatures.
>
>Getting the heat transferred off the last peltier would be the trick -
>is a heat sink going to manage it, or is it going to get fouled?
>
>-Adam
>
>Dave Tweed wrote:
>
>>"M. Adam Davis" <
adampicEraseME
.....UBASICS.COM> wrote:
>>
>>
>>>Modern active cooling is a simple heat pump - take heat from A, move it
>>>to B.
>>>
>>>I imagine that taking the heat from the hole and moving to the top of
>>>the hole, while possible, is likely not practical, ...
>>>
>>>
>>
>>Why not? All you need is a Peltier Junction array (or a stack of them)
>>that is capable of keeping a tiny insulated box containing the active
>>chips below their maximum rated temperature, while outputting the heat
>>into the drilling slurry stream at something higher than *its*
>>temperature. No moving parts; should work indefinitely as long as
>>there's sufficient electricity to run it.
>>
>>
>>
>>>There is a right way, and an ugly kludge. It's very likely that the
>>>right way is sending down equipment that can handle the stresses placed
>>>on it, rather than making the environment fit the equipment (at which
>>>point you probably lose much of the value of the data gathered down
>>>there anyway)
>>>
>>>
>>
>>Good attitude, but you need to take a top-down view. If you can create
>>an enclosure that can withstand the enviroment while providing a more
>>component-friendly environment inside, then you don't need to qualify
>>every chip, wire and solder joint inside the box for the harsher
>>environment.
>>
>>-- Dave Tweed
>>
>>--
>>
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>>