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'[EE]: Why 208 vs 150?'
2003\10\11@001424
by
Josh Koffman
Ok, I'm looking at Microchip's 24LC256 for an upcoming project. For
surface mount, there are a number of different options. Personally, I
don't really understand TSSOP, at least from the drawings it looks
large. I've never seen one in real life, or an actual comparative photo.
If anyone knows of some good photos, I'd love to see them.
Anyway, I'm looking at SO packages. In this part, Microchip offers an
150mil SO, and a 208mil SO. Is this because of metric vs imperial?
Josh
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2003\10\11@012510
by
Bob Barr
On Sat, 11 Oct 2003 00:58:55 -0400, Josh Koffman wrote:
>Ok, I'm looking at Microchip's 24LC256 for an upcoming project. For
>surface mount, there are a number of different options. Personally, I
>don't really understand TSSOP, at least from the drawings it looks
>large. I've never seen one in real life, or an actual comparative photo.
>If anyone knows of some good photos, I'd love to see them.
>
>Anyway, I'm looking at SO packages. In this part, Microchip offers an
>150mil SO, and a 208mil SO. Is this because of metric vs imperial?
>
Good thought. It certainly looks like that's probably the case.
If my math is right:
148 mils converts to 3.75 mm.
207 mils converts to 5.25 mm.
Regards, Bob
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2003\10\11@090044
by
Olin Lathrop
Josh Koffman wrote:
> Ok, I'm looking at Microchip's 24LC256 for an upcoming project. For
> surface mount, there are a number of different options. Personally, I
> don't really understand TSSOP, at least from the drawings it looks
> large. I've never seen one in real life, or an actual comparative photo.
> If anyone knows of some good photos, I'd love to see them.
The line card has 1:1 scale pictures of all the packages. It's usually a
few pages from the back.
*****************************************************************
Embed Inc, embedded system specialists in Littleton Massachusetts
(978) 742-9014, http://www.embedinc.com
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2003\10\11@125052
by
Josh Koffman
Fantastic! Thanks for the tip Olin. For the record, I still don't get
the TSSOP package style. Just seems like the SSOP with the leads on a
different side. But at least now I can see the relative sizes.
Thanks!
Josh
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Olin Lathrop wrote:
> The line card has 1:1 scale pictures of all the packages. It's usually > a few pages from the back.
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2003\10\11@170156
by
Jinx
> Just seems like the SSOP with the leads on a different side
Which is very convenient for serpentine track layouts
Particularly with devices that have bussed i/o and address
lines, like memory or LCD drivers, when between-pin tracks
on such small pitch ICs would be impractical or mean many
vias, links or extra layers
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2003\10\12@013246
by
Josh Koffman
Ah...suddenly it makes so much sense. Widen the area that has no pins,
and you can get more tracks under the device.
Cool!
Josh
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Jinx wrote:
>
> > Just seems like the SSOP with the leads on a different side
>
> Which is very convenient for serpentine track layouts
>
> Particularly with devices that have bussed i/o and address
> lines, like memory or LCD drivers, when between-pin tracks
> on such small pitch ICs would be impractical or mean many
> vias, links or extra layers
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