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'[EE]: Wafer vs. die IC package'
2005\12\13@105702 by Charles Craft

picon face
www.winbond.com.tw/c-winbondhtm/partner/PDFresult.asp?Pname=1021

My kid has a toy car carrier that's outfitted with MFID (Magnetic Field ID) to ID the cars on the truck.

The transponder chip is available in a wafer or die package.
What's the difference?


2005\12\13@111931 by Harold Hallikainen

face picon face

> http://www.winbond.com.tw/c-winbondhtm/partner/PDFresult.asp?Pname=1021
>
> My kid has a toy car carrier that's outfitted with MFID (Magnetic Field
> ID) to ID the cars on the truck.
>
> The transponder chip is available in a wafer or die package.
> What's the difference?
>


I'm gonna guess that the die package is the individual chip cut from the
large wafer. The wafer is the uncut wafer (you get to cut it yourself!).

Harold

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