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'[EE]: Design Rules (was PCB Size)'
2002\01\28@132506 by Lawrence Lile

This brings us to the discussion of Design Rules, manufacturability
standards  for PCB layout.

Several PCB houses will send you a doc describing what they think is
important in PCB layout, and tips to reduce the manufacturing cost.  They
all cover different stuff.

What do people on the list use as their own "manufacturability standards"

These cover things like minimum distance from hole to edge, minimum line
width and spacing, and so on.

Some manufacturers specify a minimum clearance around DIP packages, because
the insertion head has a certain size, and needs some board space around to
clear.  One house I use specifies 0.050" at the top (pin 1 end) of a DIP IC
to the next package or SMD, 0.300" from center of DIP to adjacent edge SMT
or IC.

I can't find any information on minimum clearance around SMT packages.  How
close to a SMT package does the placement equipment extend?  Can you place
surface mount packages end-to-end and side-to-side or does there need to be
space between them for placement?


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2002\01\28@162512 by 859-1?Q?Alexandre_Guimar=E3es?=


   I would leave a little more spacing than that if possible, specially
from SMD pad to SMD pad, but the clearances seem to be quite ok for me. As a
"rule of thumb" it seems quite reasonable to me. But check with the
manufacturer as soon as possible in the design phase for not having any
surprises afterwards. Be also very carefull about "shadow zones" and areas
with different "heat mass" distribution. That is critical, specially on pure
IR ovens.

Best regards,
Alexandre Guimaraes

{Original Message removed}

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